Page 4 - MSAM-1-2

Full issue copyright © 2022 Whioce Publishing
All rights reserved. Without permission in writing from the
publisher, this full issue publication in its entirety may not be
reproduced or transmitted for commercial purposes in any
form or by any means, electronic or mechanical, including
photocopying, recording, or any information storage and
retrieval system. Permissions may be sought from
info@whioce.com.

Article copyright © Respective Author(s)
See articles for copyright year. All articles in this full issue
publication are open-access. There are no restrictions in the
distribution and reproduction of individual articles, provided
the original work is properly cited. However, permission to
reuse copyrighted materials of an article for commercial
purposes is applicable if the article is licensed under Creative
Commons Attribution-NonCommercial License. Check the
specific license before reusing.

MATERIALS SCIENCE IN ADDITIVE MANUFACTURING

ISSN: 2810-9635 (online)
Editorial and Production Credits

Publisher – Whioce Publishing
Managing Editor - Ian Wong About the Cover
Production Editor - Ian Wong Directed energy deposition in progress
Article Layout and Typeset: Sinjore Technologies (India)
Cover Design: BUTTON GRAPHIC DESIGN STUDIO (Malaysia) Disclaimer

For all advertising queries, contact info@whioce.com. Whioce Publishing is not liable to the statements,
perspectives, and opinions contained in the
Supplementary file publications. The appearance of advertisements in

Supplementary files of articles can be obtained at the journal shall not be construed as a warranty,
https://msam.whioce.com/index.php/MSAM/issue/view/7. endorsement, or approval of the products or
services advertised and/or the safety thereof.
Whioce Publishing disclaims responsibility for any
injury to persons or property resulting from any
ideas or products referred to in the publications
or advertisements. Whioce Publishing remains
neutral with regard to jurisdictional claims in
published maps and institutional affiliations.