Page 70 - MSAM-1-2

Materials Science in Additive Manufacturing Cold spray additive manufacturing of Cu-based materials

resistance, and strength [64-68] . Titanium diboride particles composite coating. The powder particles are closely packed
do not react with copper; it has a high melting point, in the coatings. Furthermore, in Figure 18B, the coatings
[69]
high strength, resistance to wear, and hardness , which etched with FeCl solution are shown where the selective
3
make them attractive for applications in the electrical removal of copper from the surface leaves behind the
industry [66,70] . network of TiB phase. The Vickers hardness of copper-43
2
vol.% TiB coating was reported to be 378 Hv which was
[70]
In 2007, Kim et al. were successful in spraying 2
copper-43 vol.% TiB . As reported, titanium, boron, and much higher than that of the pure copper cold spray
2
copper nanocomposite powders were subjected to ball coatings, having a Vickers hardness of around 159.55 Hv as
[47]
milling for 2 min and then subjected to self-propagating reported by Chen et al. . The titanium diboride structure
high-temperature synthesis reaction (SHS). Further, the is responsible for the high hardness of copper-43 vol.%
product obtained after self-propagating high-temperature TiB cold-sprayed coatings.
2
[71]
synthesis reaction was milled again to obtain optimum size In another work, Calli et al. produced cold-sprayed
TiB particles, as shown in Figure 17. The heat of the SHS pure copper, copper-B C, copper-TiB , and copper-TiC
4
2
2
reaction got distributed evenly all around due to the good coatings. As reported, the electrical conductivity of pure
thermal conductivity of copper, which helped in the proper copper coatings was equivalent to that of the copper-
formation of TiB particles. This powder feedstock was TiB (12.5 vol.%), around 36.0 MS/m, which is more
2
2
sprayed onto a copper substrate. The cold-sprayed coating than that of the copper-B C (12.5 vol.%) coatings and
4
was reported to be 70 µm in thickness. The coatings were copper TiC (12.5 vol.%). This observation may be due to
very dense, possibly due to the huge plasticity difference the electrical conductivity of the ceramic particles used.
between the copper and TiB in these coatings. As reported, However, the relative wear rates (RWRs) were lowest
2
the coatings etched with (NH ) S O aqueous solution, as for copper-TiB coatings compared to copper-TiC and
4 2 2
2
8
shown in Figure 18A, display the microstructure of the copper-B C coatings. This result could be due to the third
4
Table 1. Summary of cold spray deposition parameters for copper‑based cold spray coatings
Powder Composition Particle diameter Gas Po To SoD Q (g/min) Substrate Ref.
(µm) (mm)
Copper Pure copper Cu (ACU 325) N 2.8 MPa 500°C 35 32.1+1.14 Cu [45]
2
Cu-Al O Cu 90,70,50 25+5 Air 6 bar 540°C 10 - Steel [30]
2 3
Al2O3 10, 30, 50
Cu-Al O – Cu Cu (90, 85, 80, and 70 wt.%), Cu (20.18 µm), Al O 3 Air 0.8 MPa 500°C 10 14 – 16 304SS [31]
2
2
3
coated graphite Al O (10 wt.%), (4.41 µm), Cu coated
2
3
Cu coated graphite (0, 5, 10, graphite (47.77 µm)
and 20 wt.%)
Cu-CNT Cu 100, 95, 90, 85 10 – 30 N 2 2.8 MPa 500°C 35 22.51 – 28.88 - [44]
CNT 0, 5, 10, 15
Cu-CNT-SiC Cu (95 vol.%)-CNT (5 vol.%) Cu (ACU 325) CNT (5 N 2 2.8 MPa 500°C 35 23.60 – 28.88 Cu [45]
SiC (10 and 20 vol.%) – 20 nm) SiC (320 grit)
Cu-CNT-AlN Cu (95 vol.%)-CNT (5 vol.%) Cu (ACU 325) CNT N 2 2.8 MPa 500°C 35 21.95 – 28.88 Cu [46]
AlN (10 and 20 vol.%) (5 – 20 nm) AlN (7 –
30 µm)
Cu- MwCNT Cu (97 vol.%) 0.5 – 3 Air 0.6 MPa 200°C - - Al [41]
MwCNT (3 vol.%)
Cu-graphene Cu (99 vol.%) Cu 15-38 µm He 2 MPa 25°C 40 - Al [52]
Graphene (1 vol.%) Graphene
5 – 30 nm
Cu-graphene Pure copper powder coated 20 Air 0.6 MPa 720 K 12 8.21 Al [53]
with graphene
Cu-MoS 2 Cu 85 vol.%/MoS (15 vol.%) Cu (26 µm) N 2 5 MPa 800°C - Cu (34.8) AA6061 [63]
2
MoS (68 µm) MoS (3.6)
2
2
Cu-MoS -WC Cu 85 vol.%, MoS (14 vol.%), Cu (26 µm) N 5 MPa 800°C - Cu+WC (39.4) AA6061 [63]
2 2 2
WC (11 vol.%) MoS (68 µm) MoS (3.6)
2
2
WC (30 µm)
Volume 1 Issue 2 (2022) 14 https://doi.org/10.18063/msam.v1i2.12