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Materials Science in Additive Manufacturing                                   Functional materials for AM




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            Figure  5.  Applications of perovskite and piezoelectric materials. (A) Microarrays of anticounterfeiting labels made from perovskites with
            polyvinylpyrrolidone. Images reproduced with permission from Liu et al.  Copyright © 2019 American Chemical Society. (B) All-3D-printed pyroelectric
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            NG (PyNG) applications, such as self-powered sensors and energy harvesting. Images reproduced with permission from Maity et al.  Copyright © 2023
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            American Chemical Society.
            control over microscale components, (iii) simplification of   3.4.1. Energy harvester and sensors
            device assembly and packaging stages, and (iv) enhanced   Piezoelectric materials can convert mechanical stress
            electromechanical  responses  and  piezoelectric  output.    or vibrations into electrical energy through structural
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            Piezoelectric devices are primarily manufactured using   deformation, leading to charge separation and
            3D printing methods such as SLA,  FDM,  DIW,       accumulation. This process generates a potential difference,
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            DLP,  and inkjet printing.  These techniques provide the   aiding  in  the  transformation  of  mechanical  to  electrical
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            potential for precise and efficient fabrication of complex 3D   energy, which can power devices immediately or be stored
            piezoelectric structures. Recent advances  in 3D  printing   for future use. Widely adopted in the industrial sector for
            technology for piezoelectric materials are summarized   its accuracy and quick response, piezoelectric materials
            in Table 5, highlighting their improved performance and   enable precise measurements of vibrations, pressure, and
            applications in sensors, pressure detectors, and energy   force, converting mechanical energy changes into electrical
            harvesting devices.                                signals for application in various technologies.


            Volume 3 Issue 2 (2024)                         13                             doi: 10.36922/msam.3323
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