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Materials Science in Additive Manufacturing                                   Functional materials for AM



            and 3D printer technology, which allows for on-demand   3.2.1. Soft sensors embedded with metallic nanoparticles
            production.                                        Polymer-based  sensors  printed  using  3D  printing
              Metal nanoparticle fillers have a direct impact on the   technology can  achieve  excellent  shape  restoration  and
            electrical and mechanical characteristics of the printed   perform various  functions depending on  the embedded
            products. 52-54  To determine the suitability of metal   conductive material. Particularly, polymer composites
            nanoparticles,  factors  such  as  electrical  conductivity,   embedded with conductive nanoparticles are known
            oxidation stability, and electrical properties can be   to exhibit a sensitive resistance response to strain and
            considered based on the required performance of    possess excellent electrical conductivity. 67-69  An ideal
            individual soft electronics. The most commonly used metal   elastic conductor maintains constant high conductivity
            nanoparticles are those of single elements, such as silver,   over a wide range of strain rates.  In particular, strain and
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            gold, and copper nanoparticles. 52-56  Among them, silver is   tactile sensors made of metals with excellent conductivity
            the most widely used conductive filler due to its outstanding   are actively being researched. The material, fabrication
            electrical  conductivity,  mechanical  rigidity,  and  high   method, and performance of the polymer-based sensor
            corrosion resistance among metals. 55-59  Moreover, silver   embedded with metallic particles are summarized in
            nanoparticles find extensive use in medical applications,   Table 3.
            as they can be employed for selective laser photothermal   Taking advantage of the fact that extrusion-based
            treatment, leveraging the surface plasmon resonance effect   DIW 3D printing allows for multi-material printing, a
            and the ability to convert strongly absorbed light into local   tactile sensor was demonstrated through a single process
            heat. 60-62  Copper nanoparticles are relatively inexpensive                                    71
            compared to silver and gold and possess similar electrical   with four different independently addressable nozzles.
            conductivity and a low electron transfer effect as silver. 53,54    The tactile sensor comprises two electrode layers, one
            However, when forming copper nanoparticles in air, an   insulating layer, a support layer, a sensor layer, and a
            oxide layer is generated on the surface for thermodynamic   base layer. The sensor layer and electrode layer contained
            stability, leading to a reduction in electrical conductivity   silver nanoparticles embedded in silicone elastomer, and
                                                               the completed sensor exhibited high flexibility, electrical
            and an increase in sintering temperature. 63-66  The   conductivity, and sensitivity. It is also possible to expand it
            formation of an oxide layer renders the sintering of copper
            nanoparticle inks technically challenging, which is one   into an array form.
            of the main reasons why copper nanoparticles are used   Strain sensors and capacitive sensors fabricated using
            less frequently than the relatively more expensive silver   a new method called hybrid 3D printing have been
            nanoparticles as conductive fillers.               reported.   Advanced  soft  sensors  are  accomplished
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            Table 3. Comparison of materials, fabrication methods, and performance of soft sensors embedded with metallic nanoparticles
            3D printing method  Material composition  Applications   Performances                    References
            Multi-material    Submicrometer-sized silver   Tactile sensor  As the pressure applied rose from 100 to   71
            extrusion (DIW)   particles+silicone elastomers          500 kPa, the device’s resistance decreased
                              (Dragon Skin 10)                       approximately twelvefold, dropping from 1.14
                                                                     kΩ to 95 Ω; gauge factor: about 180
            Material extrusion   Silver micro-flakes+thermoplastic   Microcontroller   Electrical conductivity; initial: 10 ×S/cm; at   72
                                                                                          4
            (DIW) with automated   elastomers (thermoplastic   device and   strain of 240%: 0.1 S/cm; gauge factor 13.3
            pick-and-place    urethane)               wearable device
            Feedback-controlled   Silver micro-flakes+poly (ethylene   Inductive coil   Electrical conductivity (1.38±0.0814) × 10     73
                                                                                                4
            material extrusion   oxide) (PEO)         (also suitable for   S/cm (one order of magnitude lower than bulk
            (DIW)                                     moisture sensing),   silver)
                                                      wearable device
            Coaxially material   Galinstan+silicone elastomers (737   Strain sensor  Maximum tensile strain of 100%; can be bent   74
            extrusion (DIW)   neutral cure sealant)                  up to 180 degrees
            Integrating vat   (i) DLP elastomer: acrylate-based  Strain gauge  Gauge factor: 251        75
            photopolymerization   (ii)  DLP plastic: acrylate-thiol
            (DLP) and material   based
            extrusion (DIW)   (iii)  DIW ink: photosensitive ink,
                                conductive silver ink, and
                                LCE ink
            Abbreviations: DIW: Direct ink writing; DLP: Digital light processing; LCE: Liquid crystal elastomers.


            Volume 3 Issue 2 (2024)                         9                              doi: 10.36922/msam.3323
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