Page 26 - ESAM-1-2

Engineering Science in
Additive Manufacturing AM-CFRP structures for EMWA properties

and geometry, facilitating the fabrication of complex, Ethics approval and consent to participate
graded, and multifunctional absorbers. The ability to
precisely engineer fiber orientation, filler distribution, Not applicable.
and metamaterial-inspired designs has significantly Consent for publication
improved EMWA efficiency while maintaining structural
integrity. Furthermore, integrating conductive and Not applicable.
magnetic nanofillers within CFRP matrices has expanded Availability of data
the possibilities for developing lightweight, high-
strength absorbers suitable for aerospace, defense, and Not applicable.
telecommunications applications. This review consolidates
current knowledge on the EMWA mechanisms of References
AM-CFRP structures, offering insights into material 1. Lv H, Cui J, Li B, Yuan M, Liu J, Che R. Insights into civilian
selection, manufacturing optimization, and performance electromagnetic absorption materials: Challenges and
evaluation. The findings presented here establish a innovative solutions. Adv Funct Mater. 2024;35:2315722.
foundation for future research, encouraging further doi: 10.1002/adfm.202315722
exploration of advanced nanocomposites and innovative 2. Wang W, Li Z, Su R, Huang Y, Li Y, He R. Advanced 3D
additive manufacturing strategies to meet the growing printing accelerates electromagnetic wave absorption from
demand for high-performance electromagnetic protection ceramic materials to structures. NPJ Adv. Manuf. 2025;2(1):2.
systems. By continuing to refine material formulations
and fabrication techniques, next-generation AM-CFRP doi: 10.1038/s44334-024-00013-w
absorbers can achieve even greater efficiency, durability, 3. Wang YF, Zhu L, Han L, Zhou XH, Gao Y, Lv LH.
and versatility in real-world applications. Recent progress of one-dimensional nanomaterials for
microwave absorption: A review. ACS Appl Nano Mater.
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None. doi: 10.1021/acsanm.3c00818
4. Jie H, Zhao Z, Zeng Y, et al. A review of intentional
Funding electromagnetic interference in power electronics:
This work was supported by the Guangdong Innovative Conducted and radiated susceptibility. IET Power Electron.
2024;17(12):1487-1506.
and Entrepreneurial Research Team Program
(No. 2021ZT09X256), High Level of Special Funds (No. doi: 10.1049/pel2.12685
G03034K003), and Shenzhen Science and Technology 5. Lin J, Huang J, Guo Z, et al. Hydrophobic multilayered PEG
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Conflict of interest shielding for electronic devices. Small. 2024;20(46):2402938.
Yi Xiong is an Editorial Board Member of this journal but doi: 10.1002/smll.202402938
was not in any way involved in the editorial and peer-review 6. Albert AA, Parthasarathy V, Kumar PS. Review on
process conducted for this paper, directly or indirectly. recent progress in epoxy‐based composite materials for
Separately, other authors declared that they have no known electromagnetic interference (EMI) shielding applications.
competing financial interests or personal relationships that Polym Compos. 2024;45(3):1956-1984.
could have influenced the work reported in this paper. doi: 10.1002/pc.27928
Author contributions 7. Ma Q, Dong K, Li F, Yu M, Xiong Y. Inverse design of
material, structure, and process for dielectric properties of
Conceptualization: All authors additively manufactured PLA/BaTiO polymer composites.
3
Data curation: Quanjin Ma, Ke Dong, Feirui Li Compos Commun. 2025;55:102314.
Funding Acquisition: Quanjin Ma, Ming Yu, Yi Xiong doi: 10.1016/j.coco.2025.102314
Methodology: Quanjin Ma, Ke Dong, Yanjie Wu
Project Administration: Ming Yu, Yi Xiong 8. Shi S, Jiang Y, Ren H, et al. 3D-printed carbon-based
conformal electromagnetic interference shielding module
Resources: Jing Tian, Ming Yu, Yi Xiong for integrated electronics. Nanomicro Lett. 2024;16(1):85.
Writing – original draft: Quanjin Ma, Ke Dong, Feirui Li,
Yanjie Wu doi: 10.1007/s40820-023-01317-w
Writing – review & editing: Jing Tian, Ming Yu, Yi Xiong 9. Xia Y, Gao W, Gao C. A review on graphene‐based

Volume 1 Issue 2 (2025) 20 doi: 10.36922/ESAM025160008