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Engineering Science in
            Additive Manufacturing                                          Multi-material additive manufacturing of metals



            significant role in determining the metallurgical bonding   to another. Although the elemental composition of both
            between dissimilar materials.                      alloys is different, they produced a near-homogeneous
                                                               martensitic microstructure due to the high cooling rate.
            3.2. Titanium-based bimetallic alloys
                                                                 In contrast, the interface in a Ti-6Al-4V/SS410
            A    Ti-6Al-4V/Ti-5Al-2.5Sn  bimetallic  structure,  bimetallic structure observed by Onuike et al.  exhibited
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            manufactured via MM-LDED and tested by Wei et al.,    a narrow (15 μm) transition region with numerous cracks
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            exhibited high-quality metallurgical bonding, attributed   perpendicular to the interface due to the immiscibility
            to  optimized  deposition  parameters.  Throughout  the   of SS and Ti alloy. Both materials were discerned by a
            entire specimen, defects such as pores, cracks, and lack of   thin layer of phase mixture (Figure 6A). To overcome the
            fusion were notably scarce, underscoring the efficacy of the   immiscibility of Ti-6Al-4V and SS410, niobium (Nb)
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            employed parameters and the presence of extremely high   and Ni-chromium alloy (NiCr)  were used as an IBL to
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            thermal gradients along the build direction.  In addition,   optimize the metallurgical bonding. Ti-6Al-4V/Nb/SS410
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            an EDS line scanning profile of the as-built specimen   fabricated using MM-LDED showed a good metallurgical
            revealed an interdiffusion region spanning 70 μm at the   bonding with no cracks or de-bonding. Due to the
            interface,  with  the  elemental  composition  transitioning   Marangoni convection, an upward movement of elements
            from Tin (Sn)-dominant to Vanadium (V)-dominant. A   such as Ti, V, and Nb into the SS410 layer was observed using
            strong Marangoni convection allowed the V elements to   EDS (Figure 6B). Notably, no brittle intermetallic phases
            move downward and the Sn elements to move upward
            within the molten liquid. This well-interfacial bonding   (e.g., FeTi and Fe Ti) were detected at the IBL, emphasizing
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            between dissimilar materials increased its strength   the role of Nb as an intermediate bond and diffusion barrier
                                                               layer. This highlights its effectiveness in mitigating brittle
            compared to Ti-5Al-2.5Sn layers. The physical and thermal   intermediate phases and reducing thermal stresses.
            properties of Ti-6Al-4V and Ti-5Al-2.5Sn were consistent,
            which  is  evidently  represented  in  the  interface  bonding,   Conversely, in Ti-6Al-4V/NiCr/SS410, a significant
            indicating a smooth transition of elements from one side   number of pores were observed at the interface,


                          A


















                          B












            Figure  6.  Interfacial characteristics of titanium (Ti)-based bimetallic structures. These structures were fabricated using (A) Ti-6Al-4V/NiCr/SS410
            MM-laser-directed energy deposition (LDED)  and (B) Ti-6Al-4V/Nb/SS410 MM-LDED.  The images reveal the interfacial evolution and metallurgical
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            bonding behavior across the Ti-base alloy combination with interlayer, with particular emphasis on elemental transition, interlayer strategies, crack
            formation, and phase formation. Scale bars: 10 μm, 50 μm, 200 μm, 400 μm, 500 μm, and 0.5 mm. Reprinted with permission from Sahasrabudhe et al.
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            (Copyright © 2014, Elsevier B.V.) and Onuike and Bandyopadhyay  (Copyright © 2018 Elsevier B.V.).
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            Volume 1 Issue 2 (2025)                         12                         doi: 10.36922/ESAM025180010
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