Page 44 - MSAM-1-2
P. 44

Materials Science in Additive Manufacturing                     Intense pulsed light sintering of conductive film



            technique is observed. As such, a hybrid multi-objective   Conflict of interest
            optimization approach is proposed to find the optimum
            solutions within the operating windows. In the proposed   The authors declare no conflict of interest.
            methodology, the response surface methodology is used to   Author contributions
            study the individual effects and their interactions of the main
            variables on the sheet resistance and the surface roughness   Conceptualization: Guo Liang Goh
            of the printed silver film. The conflicting relationship   Data curation: Guo Dong Goh
            between the sheet resistance and the surface roughness was   Funding acquisition: Wai Yee Yeong
            ascertained by the RSMs. Then the 2D optimal operating   Investigation: Guo Dong Goh
            windows were ascertained by a desirability function   Methodology: Guo Liang Goh, Haining Zhang
            approach to reduce the inherent conflict of the print passes   Software: Haining Zhang
            of the printed film and the sintering distance of the IPL   Supervision: Wai Yee Yeong, Tzyy Haur Chong
            sintering process. Thereafter, the derived RSMs and the   Writing – original draft: Guo Liang Goh, Guo Dong Goh
            corresponding statistical uncertainty were jointly driven   Writing – review & editing: Tzyy Haur Chong
            with the NSGA-III to methodically optimize the overall   References
            printing quality in 2D space. The experimental results
            demonstrate that the suggested hybrid multi-objective   1.   Tan H, Tran T, Chua C, 2016, A review of printed passive
            optimization  approach  was  advantageous  to  reduce   electronic components through fully additive manufacturing
            the contradiction between the sheet resistance and the   methods. Virtual Phys Prototyp, 11: 271–288.
            surface roughness, yielding printed films with low surface      https://doi.org/10.1080/17452759.2016.1217586
            roughness and low sheet resistance.                2.   Saengchairat N, Tran T, Chua CK, 2017, A review: Additive
              Comparing to the conventional trial-and-error method,   manufacturing for active electronic components.  Virtual
            the suggested optimization methodology is found to be more   Phys Prototyp, 12: 31–46.
            efficient and systematic. It should be pointed out, however,      https://doi.org/10.1080/17452759.2016.1253181
            that the optimal windows will vary significantly depending   3.   Fisher G, Seacrist MR, Standley RW, 2012, Silicon crystal
            on the types of ink and substrate properties. Nevertheless,   growth and wafer technologies. Proc IEEE, 100: 1454–1474.
            this work outlined a systematic approach for determining the      https://doi.org/10.1109/jproc.2012.2189786
            optimal windows for the IPL sintering process of the aerosol
            jet printed films that can also be applied when other types   4.   Tan HW, An J, Chua CK, et al., 2019, Metallic nanoparticle
            of ink or substrate are used. For potential research work,   inks for 3D printing of electronics.  Adv Electron Mater,
            the influence of the number of pulse and pulse duration can   5: 1800831.
            be  systematically  studied  for  aerosol  jet printed  silver film.      https://doi.org/10.1002/aelm.201800831
            Furthermore, this work outlines effective approaches for   5.   Saidina D, Eawwiboonthanakit N, Mariatti M, et al., 2019,
            optimizing the electrical property and the surface morphology   Recent development of graphene-based ink and other
            of the nanoparticle-based film which can potentially allow for   conductive material-based inks for flexible electronics.
            the homogeneous deposition of material for the subsequent   J Electron Mater, 48: 3428–3450.
            layers of multi-layered and multi-material electronics such as      https://doi.org/10.1007/s11664-019-07183-w
            an electrochemical electrode with a dielectric passivation layer.
                                                               6.   Yang W, List-Kratochvil EJ, Wang C, 2019, Metal particle-
            Acknowledgments                                       free inks for printed flexible electronics. J Mater Chem C,
                                                                  7: 15098–15117.
            None.
                                                                  https://doi.org/10.1039/c9tc05463d
            Funding                                            7.   Bhat KS, Ahmad R, Wang Y, et al., 2016, Low-temperature
                                                                  sintering of highly conductive silver  ink for flexible
            This research is supported by the National Research   electronics. J Mater Chem C, 4: 8522–8527.
            Foundation,  Prime  Minister’s  Office,  Singapore  under
            its Medium-Sized Centre funding scheme and PUB,       https://doi.org/10.1039/c6tc02751b
            Singapore’s National Water Agency under its Urban   8.   Xu Z, Dong Q, Qtieno B,  et al., 2016, Real-time  in situ
            Solutions & Sustainability (Competitive Research      sensing of multiple water quality related parameters using
            Programme [Water] Scheme, PUB-1804-0075), and the     micro-electrode array (MEA) fabricated by inkjet-printing
            Key Natural Science Project of Anhui Provincial Education   technology (IPT). Sens Actuators B Chem, 237: 1108–1119.
            Department (No. KJ2021A1111).                         https://doi.org/10.1016/j.snb.2016.09.040


            Volume 1 Issue 2 (2022)                         13                     http://doi.org/10.18063/msam.v1i2.10
   39   40   41   42   43   44   45   46   47   48   49