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Designs and Applications of EHD 3D Printing

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           Figure 4. (A) Polyurethane etch resist for a circuit is printed by electrohydrodynamic (EHD) before etching the metal layer. (B) EHD printed
           array of source or drain electrode pairs after deposition of resist layer, etching of metal, and stripping the resist (adapted from Park et al. ).
                                                                                                            [9]
           (C) Surface morphology of the edge of the silver tracks scanned by scanning electron microscope at a magnification of ×5000 (adapted from
           Wang et al.). (D) A printed coated resistor. (E) A printed interdigitated capacitor. (F) A printed spiral inductor (adapted from Wang et al. ).
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           ink without any particle structure, on the substrate, and   boards and backplanes of printable transistors . Since
                                                                                                      [27]
           a  photo-curable  polymer  droplet  was  printed  at  two   noble nanoparticles, such as gold and silver, have good
           intersecting conductive lines as isolating points .  electrical conductivity and non-oxidizing properties, their
                                                  [11]
           The latter  material,  which is a liquid ink containing   colloidal solution is firstly applied in the application of
           metal nanoparticles, is usually directly deposited on the   electronics. Khan et al. used a multinozzle to print three
           substrate; then, heating the metal  nanoparticles  makes   parallel conductive lines made out of colloidal solution
           them connect to each other. Heating process helps those   containing silver particles and the width of line is about
           particles to remove cover and form a continuous dense   140 µm. After sintering at 250°C for 1 h at a constant
           metal structures. EHD inkjet printing is able to print   heating rate of 2°C/min, the resistivity of silver line is
           conductive  lines  for  metallization  in  printed  circuit   5.05 × 10 Ω  m,  3 times  higher  than  the  resistivity  of
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           6                           International Journal of Bioprinting (2019)–Volume 5, Issue 1
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