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Materials Science in Additive Manufacturing                           Additive manufacturing of active optics



            and precision, making it a popular choice for integrating   of inkjet printing also allows for the integration of
            functional materials such as luminescent polymers and   optical elements into complex circuits, making it a
            QDs into optoelectronic devices.                   valuable tool for applications in displays, sensors, and
              While DLP is a highly versatile and precise technique,   telecommunications. 101
            it faces challenges such as a reliance on photopolymers,   While both DIW and inkjet printing provide powerful
            which limits material diversity, and difficulties in achieving   tools for fabricating advanced optoelectronic devices,
            uniform light curing over large build areas. Surface   they face challenges that researchers are actively working
            defects and resolution inconsistencies caused by layer-by-  to  address.  For  DIW,  improving  the  printing  resolution
            layer  processing  also  remain  areas  of  concern.  Ongoing   without compromising the ability to handle highly viscous,
            research aims to address these issues by developing hybrid   multi-material inks is a key focus.  For inkjet printing,
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            resin systems with improved thermal and mechanical   enhancing the uniformity and reliability of droplet
            stability and exploring advanced projection techniques   deposition, particularly for larger-scale applications,
            to enhance light uniformity and resolution. 97-100  These   remains an important area of innovation.  In addition,
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            innovations  are  expected  to  expand  DLP’s  capabilities   efforts are being made to expand the range of compatible
            for fabricating scalable, high-performance optoelectronic   inks by developing formulations with improved thermal
            devices  in applications such as  displays, sensors, and   stability, mechanical robustness, and functionality.  These
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            telecommunications.                                advancements aim to unlock the full potential of DIW
                                                               and inkjet printing in producing next-generation light-
            5.3. DIW and inkjet printing                       emitting devices for photonic and optoelectronic systems.
            DIW and inkjet printing are both additive manufacturing
            techniques that involve the deposition of functional   5.4. 2PP
            inks to build structures, but they differ in terms of their   2PP  is  a  high‑resolution  additive  manufacturing
            mechanisms and applications. DIW involves the extrusion   technique that utilizes femtosecond laser pulses to initiate
            of ink through a nozzle to form 3D structures layer-by-layer,   polymerization  within  a  photosensitive  material.  This
            making it particularly effective for creating multi-material   method allows for sub-wavelength resolution, enabling the
            devices with intricate geometries. Inkjet printing, on the   fabrication of highly detailed micro- and nanoscale optical
            other hand, uses a non-contact approach, where droplets   components. 2PP has been employed to create fluorescent 3D
            of ink are precisely deposited onto a substrate, allowing for   metastructures with complex geometries and high precision.
            highly controlled patterns. Both methods have been widely   An example of this is the additive manufacturing of
            adopted in the fabrication of light-emitting devices due to   highly fluorescent organic 3D metastructures,  where
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            their ability to incorporate advanced materials, such as   2PP  was  used  to  achieve  sub‑wavelength  resolution  for
            QDs and organic semiconductors.                    light-emitting  devices,  enhancing  the design of  micro-
              In the field of optoelectronics, DIW has been used   optical components for advanced photonic applications.
            to fabricate QDs LEDs by depositing QDs inks in      However,  like  many  emerging  technologies,  2PP
            high-resolution patterns. These 3D-printed QD-LEDs   faces  challenges in  scalability  due  to its  relatively slow
            demonstrate the flexibility and performance required for   fabrication speeds, which limit its practicality for large-
            applications such as displays and sensors, with tunable   scale  production.  Material  compatibility  is  another
            light emission properties and efficient material utilization.   limitation, as it relies on photopolymerizable materials,
            The precise material placement enabled by DIW allows   restricting the range of usable materials. Despite these
            for the creation of complex, multi-functional devices that   challenges,  significant  progress  has  been  made.  High‑
            integrate optical and electronic elements within a single   speed scanning systems and parallel multi-beam setups are
            structure. 57                                      addressing throughput concerns,  while the development
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              Inkjet printing complements DIW by offering a highly   of advanced photoresins and hybrid materials is expanding
            scalable, low-cost method for producing optoelectronic   material versatility.  These advancements demonstrate
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            components with excellent spatial control. Inkjet printing   the potential for 2PP to transition from research‑focused
            has been used to fabricate organic photonics, such as   applications to industrial-scale production of high-
            microring lasers and integrated circuits, where organic   performance optical devices.
            and QD materials are deposited in precise configurations.
            This technique is particularly suitable for wearable and   5.5. SLS
            flexible devices, as it enables the direct printing of light-  SLS is a powder-based additive manufacturing technique
            emitting materials onto soft substrates. The precision   that uses a laser to selectively fuse powdered materials


            Volume 3 Issue 4 (2024)                         16                             doi: 10.36922/msam.5748
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