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International Journal of Bioprinting Different modeling of porous scaffolds
Figure 7. Compression deformation behavior of different scaffolds. Abbreviations: D, Diamond; F, Fill; G, Gyroid; IW-P, I-graph-wrapped package; P,
Primitive; T, Thicken.
The results showed that the elastic modulus of the scaffolds surface thickening slightly increases or maintains
was comparable to the modulus of human bone, confirming the scaffold’s ultimate strength, elastic modulus, and
that the use of porous structures is an effective way to fracture strain. This is mainly because surface thickening
reduce the modulus and the “stress shielding” effect. 49 increases the uniform distribution of material in the
horizontal direction, enhancing the material’s resistance
Figure 8A–C shows the comparison of mechanical to vertical loads. In the case of the P-filled structure, the
performance among different scaffolds. When looking material’s own structural pillar size is larger, resulting in
at different minimal surface unit types, the order of a more pronounced homogenization effect. The stress it
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scaffold ultimate strength is P > G > D > IW-P, and the experiences is significantly greater in the vertical direction
order of elastic modulus is similar to the strength ranking. compared to the horizontal direction, with vertical pillars
When considering the two modeling methods, surface primarily bearing the load. Figure 8D demonstrates
thickening and filling, for G, D, and IW-P structures, the performance of the scaffolds prepared in this work
Table 4. Mechanical performance of different scaffolds
Yield strength (MPa) Ultimate strength (MPa) Elastic modulus (GPa) Ductility (%)
P-F 155.14 ± 7.58 250.90 ± 35.57 3.91 ± 0.47 12.47 ± 1.86
P-T 170.87 ± 7.37 196.34 ± 10.41 3.29 ± 0.18 12.49 ± 1.14
G-F 136.66 ± 17.04 183.06 ± 7.81 3.55 ± 0.11 8.61 ± 0.97
G-T 162.00 ± 7.00 181.11 ± 7.51 4.57 ± 0.19 10.94 ± 0.36
D-F 119.35 ± 15.77 137.99 ± 19.88 3.45 ± 0.13 6.74 ± 0.45
D-T 152.39 ± 9.98 186.05 ± 12.44 3.24 ± 0.06 5.73 ± 0.82
IW-P-F 113.97 ± 8.14 135.78 ± 10.19 3.03 ± 0.11 6.02 ± 1.04
IW-P-T 170.71 ± 3.50 205.27 ± 4.90 3.51 ± 0.07 9.43 ± 2.44
Abbreviations: D, Diamond; F, Fill; G, Gyroid; IW-P, I-graph-wrapped package; P, Primitive; T, Thicken.
Volume 10 Issue 3 (2024) 434 doi: 10.36922/ijb.2565

